Chengyan StudioComputational Research Services

半导体

Semiconductors

Covering material properties, thermo-mechanical reliability, growth and manufacturing, ferroelectric materials, and advanced integration and packaging, we study electronic structure, defects and doping, thin-film growth, thermal stress and interface reliability.

Material Properties

Electron–Phonon Transport

Electron–Phonon Transport

Band structure, phonon dispersion, electron–phonon coupling, mobility, scattering mechanisms, Brillouin-zone high-symmetry points

Defects and Doping

Defects and Doping

Defect formation energy, charge states, dopant levels, DOS/PDOS, local relaxation, compensation mechanisms

Heterointerfaces

Heterointerfaces

Interface structure, band alignment, charge transfer, interface dipole, strain mismatch, interface states

Thermo-mechanical Reliability

Interfacial Heat Transport

Interfacial Heat Transport

Interfacial thermal conductance, phonon transmission, thermal boundary resistance, spectral matching, interface scattering, temperature gradient

Thermal Stress and Deformation

Thermal Stress and Deformation

Thermal-expansion mismatch, stress distribution, strain field, warpage, delamination risk, thermal cycling

Growth and Manufacturing

Ion Implantation and Annealing

Ion Implantation and Annealing

Implantation damage, defect evolution, annealing recovery, dopant activation, depth profiles, lattice repair

Epitaxial Growth

Epitaxial Growth

Epitaxial orientation, lattice mismatch, growth modes, interfacial defects, strain relaxation, film quality

Ferroelectric Materials

Vacancies and Ferroelectric Mechanisms

Vacancies and Ferroelectric Mechanisms

Oxygen vacancies, defect dipoles, polarization stability, switching barriers, local distortion, leakage correlation

Ferroelectric Domains and Polarization

Ferroelectric Domains and Polarization

Domain structure, polarization orientation, domain-wall energy, switching paths, remnant polarization, electric-field response

Ferroelectric Phase Formation

Ferroelectric Phase Formation

Phase stability, transformation pathways, lattice distortion, strain-induced phases, free-energy comparison, phase-boundary structure

Advanced Integration and Packaging

Electromigration

Electromigration

Atomic migration, void nucleation, current density, temperature coupling, lifetime assessment, interconnect failure

Multi-chip Integration

Multi-chip Integration

Chip stacking, interconnect topology, signal integrity, power distribution, thermal coupling, system-level co-design

Hybrid Bonding

Hybrid Bonding

Plasma activation, room-temperature dielectric bonding, annealing Cu join-up, Cu/dielectric interface, bond strength, void control

Thermal Management

Thermal Management

Hotspot distribution, heat-conduction paths, package thermal resistance, TIM materials, temperature uniformity, thermal reliability